Copper is a kind of relatively pure copper, which can be generally
considered as pure copper. It has good conductivity and plasticity,
but its strength and hardness are worse. Copper has excellent
thermal conductivity, ductility and corrosion resistance. Trace
impurities in copper have a serious impact on the conductivity and
thermal conductivity of copper. Titanium, phosphorus, iron and
silicon significantly reduce the conductivity, while cadmium and
zinc have little effect. Sulphur, selenium and tellurium have
little solid solubility in copper, and can form brittle compounds
with copper, which have little effect on conductivity, but can
reduce processing plasticity.
Copper has good corrosion resistance in atmosphere, sea water, some
non-oxidizing acids (hydrochloric acid, dilute sulfuric acid),
alkali, salt solution and a variety of organic acids (acetic acid,
citric acid), and is used in chemical industry. In addition, copper
has good weldability and can be processed into semi-finished
products and finished products by cold and thermoplastic
processing. In the 1970s, the output of copper exceeded that of
other copper alloys.
physical property
Trace impurities in copper have a serious impact on the
conductivity and thermal conductivity of copper. Titanium,
phosphorus, iron and silicon significantly reduce the conductivity,
while cadmium and zinc have little effect. Oxygen, sulphur,
selenium and tellurium have little solid solubility in copper, and
can form brittle compounds with copper, which have little effect on
conductivity, but can reduce processing plasticity. When ordinary
copper is heated in a reducing atmosphere containing hydrogen or
carbon monoxide, hydrogen or carbon monoxide easily reacts with
cuprous oxide (Cu2O) at grain boundaries to produce high pressure
steam or carbon dioxide gas, which can cause copper to rupture.
This phenomenon is often called "hydrogen disease" of copper.
Oxygen is harmful to the weldability of copper. Bismuth or lead
form eutectic with copper at low melting point, which makes copper
brittle; while brittle bismuth distributes in thin film at grain
boundary, which makes copper brittle. Phosphorus can significantly
reduce the conductivity of copper, but it can improve the fluidity
of copper liquid and weldability. Appropriate amounts of lead,
tellurium and sulphur can improve the machinability. The room
temperature tensile strength of annealed copper sheet is 22-25
kg/mm 2, the elongation is 45-50%, and the Brinell hardness (HB) is
35-45.
The thermal conductivity of pure copper is 386.4w/(m.k)
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